CMOS Imaging Workshop

Presentations held at the 5th Fraunhofer IMS Workshop "CMOS Imaging Low-Light Imaging" May 4th and 5th, 2010 Duisburg / Germany. For enquiries please contact Mrs. Cornelia Metz at Fraunhofer IMS. Phone: +49 (0)203 / 3783-210; e-mail:

IMS_Fraunhofer_Flyer_Workshop.pdf


  1. "Noise as a Measurement Tool", Albert Theuwissen, Harvest Imaging & Technical University of Delft, The Netherlands.
  2. "Solid-State X-Ray Imaging", Walter Rütten, Philips Technologie GmbH Forschungslaboratorien, Germany.
  3. "Solid-State ToF-Sensors", Werner Brockherde, Fraunhofer IMS, Germany.
  4. "Safe CMOS Camera System for Three-Dimensional Zone Monitoring", Sören Hader, Pilz, Germany.

Publications

Project and pre-project publications:


  1. C. Herrmann, R. Steadman, O. Mülhens, "ChromAIX: Fast energy resolved photon-counting readout electronics for Future Human Computed Tomography", IEEE NSS MIC RTSD 2010, Knoxville, USA.
  2. "An overview of the High Dynamic Range logarithmic Imagers"
    http://www.ims-chips.de/home.php?id=a2b3c2en
  3. B. Höfflinger ed., "HDR Vision" Springer Berlin Heidelberg New York, 2007.
  4. J. N. Burghartz, H.-G. Graf, C. Harendt, W. Klingler, H. Richter, M. Strobel, "HDR CMOS Imagers and Their Applications&quout;, Proceedings 8th International Conference on Solid-State and Integrated Circuit Technology, pp.528 - 531, 2006.
    http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=4098156
  5. U.Seger, U.Apel, B.Hoefflinger, "HDRC-Imagers for Natural Visual Perception," Handbook of Computer Vision and Application, Vol 1, pp. 223-235 (1999).
  6. U.Seger, H.-G.Graf, M.E.Landgraf, "Vision Assistance in Scenes with Extreme Contrast, "IEEE Micro 13 (1), pp.50-56 (1993).
  7. Alexander Fish, Alexander Belenky and Orly Yadid-Pecht, "Wide Dynamic Range Snapshot APS for Ultra Low-Power Applications", IEEE Transactions on Circuits and Systems, Part II: Express Briefs, Vol. 52, n°11, pp. 729-733, Nov. 2005.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1532444
  8. J. Rhee and Y.Joo, "Dual-Mode Wide Dynamic-Range CMOS Active Pixel Sensor", Electronics Letters, Vol. 41, n°24, pp. 1322-1323, Nov. 2005.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1550112
  9. Mitsuhito Mase, Shoji Kawahito, Maasaki Sasaki, Yasuo Wakamori and Masanori Furuta, "A Wide Dynamic Range CMOS Image Sensor With Multiple Exposure-Time Signal Outputs and 12-bit Column-Parallel Cyclic A/D Converters", IEEE Journal of Solid-State Circuits, Vol. 40, n°12, pp. 2787-2795, December 2005.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1546253
  10. Nana Akahane, Shigetoshi Sugawa, Satoru Adachi, Kazuya Mori, Toshiyuki Ishiuchi and Koichi Mizobuchi, "A Sensitivity and Linearity Improvement of a 100-dB Dynamic-Range CMOS Image Sensor Using A Lateral Overflow Integration Capacitor", IEEE Journal of Solid-State Circuits, Vol. 41, n°4, pp. 851-858, April 2006.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1610629
  11. Nicola Massari and Massimo Gottardi, "A 100 dB Dynamic-Range CMOS Vision Sensor With Programmable Image Processing and Global Feature Extraction", Journal of Solid-State Circuits, Vol. 42, n° 3, pp. 647-657, March 2007.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=4114756
  12. Masaaki Sasaki, Mitsuhito Mase, Shoji Kawahito and Yoshiaki Tadokoro, "A Wide-Dynamic-Range CMOS Image Sensor based on Multiple Short Exposure-Time Readout With Multiple-Resolution Column-Parallel ADC", IEEE Sensors Journal, Vol. 7, n°1, pp. 151-157, January 2007.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=4049780
  13. David Stoppa, Monica Vatteroni, Daniele Covi, Andrea Baschirotto, Alvise Sartori and Andrea Simoni, "A 120-dB Dynamic-Range CMOS Image Sensor With Programmable Power Responsivity", IEEE Journal of Solid-State Circuits, Vol. 42, n°7, pp 1555-1562, July 2007.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=4099793
  14. Estelle Labonne, Gilles Sicard, Marc Renaudin and Pierre-Damien Berger, "A 100dB Dynamic Range CMOS Image Sensor With Global Shutter", IEEE Int. Conf. on Electronics, Circuits and Systems, 2006, pp. 1133-1136.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=4263571
  15. Alexander Belenky, Alexander Fish, Arthur Spivak and Orly Yadid-Pecht, "Global Shutter CMOS Image Sensor With Wide Dynamic Range", IEEE Transactions on Circuits and Systems, Part II: Express Briefs, Vol. 54, n°12, pp. 1032-1036, December 2007.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=4263366
  16. Bongki Mheen, Young-Joo Song and Albert J.P. Theuwissen, "Negative Offset Operation of Four-Transistor CMOS Image Pixels for Increased Well Capacity and Suppressed Dark Current", IEEE Electron Device letters, Vol. 29, n°4, pp. 347-349, April 2008.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=4469303
  17. Bhaskar Choubey and Steve Collins, "Wide Dynamic Range CMOS Pixels With Reduced Dark Current", Analog Integrated Circuits and Signal Processing, Vol. 56, n°1, pp. 53-60, Springer Verlag 2008.
    http://www.springerlink.com/content/f51246475162240x/
  18. Zeljko Ignjatovic, Yang Zhang, Mark F. Bocko, "CMOS image sensor readout employing in-pixel transistor current sensing", ISCAS 2008, pp. 1858-1861
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=4541803
  19. Noriko Ide, Woonghee Lee, Nana Akahane and Shigetoshi Sugawa, "A Wide DR and Linear Response CMOS Image Sensor With Three Photocurrent Integrations in Photodiodes, Lateral Overflow Capacitors and Column Capacitors", IEEE Journal of Sold-State Circuits, Vol. 43, n°7, pp. 1577-1587, July 2008.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?tp=&arnumber=4550639&isnumber=4550626
  20. Zeljko Ignjatovic and Mark F. Bocko, "A 0.88nW/pixel, 99.6 dB Linear-Dynamic-Range Fully-Digital Image Sensor Employing a Pixel-Level Sigma-Delta ADC", VLSI Symposium 2006.
    http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=1705293
  21. G. Nagy, Gy. Horváth, A. Poppe, "Consideration of Thermal Effects in Logic Simulation", In: Proceedings of the 14th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC'08). Rome, Italy, 24/Sep/2008-26/Sep/2008. pp. 229-234.
  22. A. Poppe, A. Vass-Várnai, G. Farkas, M. Rencz, "Package characterization: simulations or measurements?", In: Proceedings of the 10th Electronics Packaging Technology Conference (EPTC'08). Singapore, 10/Dec/2008-12/Dec/2008.
  23. V. Székely, G. Somlay, P. G. Szabó, M. Rencz, "Design of a static TIM tester", In: Proceedings of the 14th International Workshop on Thermal investigations of ICs and Systems (THERMINIC'08). Rome, Italy, 24/Sep/2008-26/Sep/2008. pp. 132-136.
  24. J. Liu, B. Michel, M. Rencz, C. Tantolin, C. Sarno, R. Miessner, K.-V. Schuett, X. Tang, S. Demoustier, A. Ziaei, "Recent Progress of Thermal Interface Material Research — An Overview", In: Proceedings of the 14th International Workshop on Thermal investigations of ICs and Systems (THERMINIC'08). Rome, Italy, 24/Sep/2008-26/Sep/2008. pp. 156-162.
  25. Á. Vámos, M. Rencz, "FPGA Power Model for Minimizing the Thermal Dissipation", In: Proceedings of the 14th International Workshop on Thermal investigations of ICs and Systems (THERMINIC'08). Rome, Italy, 24/Sep/2008-26/Sep/2008. pp. 148-151.
  26. A. Poppe, Gy. Horváth, G. Nagy, M. Rencz, V. Székely, "Electro-thermal and logi-thermal simulators aimed at the temperature-aware design of complex integrated circuits", In: Proceedings of the 24th IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'08). San Jose, USA, 16/Mar/2008-20/Mar/2008. pp. 69-77.
  27. P. Szabó, M. Rencz, "Short time die attach characterization of semiconductor devices", In: Proceedings of the 13th International Workshop on Thermal investigations of ICs and Systems (THERMINIC'07). Budapest, Hungary, 17/Sep/2007-19/Sep/2007. pp. 12-17.
  28. Y. Zhang, G. Farkas, A. Poppe, A. Manning, G. Yip, D. Mullen, "Thermal Analysis of Memory Module Using Transient Testing Method", In: Proceedings of the 23rd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'07). San Jose, USA, 18/Mar/2007-22/Mar/2007. pp. 7-11.
  29. M. Rencz, V. Székely, A. Poppe, "A Methodology for the Co-simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards", IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 30:(3) pp. 367-374. (2007)
  30. A. Poppe, G. Farkas, J. Parry, P. Szabó, M. Rencz, V. Székely, "DELPHI Style Compact Modeling of Stacked die Packages", In: Proceedings of the 23rd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'07). San Jose, USA, 18/Mar/2007-22/Mar/2007. pp. 248-254.
  31. P. Szabó, A. Poppe, M. Rencz, "Studies on the possibilities of in-line die attach characterization of semiconductor devices", In: K. Vaidyanathan, T.Y. Tee, T.K. Lee (ed.), Proceedings of the 9th Electronics Packaging Technology Conference (EPTC'07). Singapore, 10/Dec/2007-12/Dec/2007. pp. 779-784.
  32. G. Nagy, A. Poppe, "Low-voltage, low-power solutions for wireless autonomous sensors aimed for AmI applications", In: Mixed Design of Integrated Circuits and Systems (MIXDES) 2006. Gdynia, Poland 22/Jun/2006-24/Jun/2006.
  33. P. Szabó, A. Poppe, G. Farkas, V. Székely, B. Courtois, M. Rencz, "Thermal Characterization and Compact Modeling of Stacked die Packages", In: Proceedings of The 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM'06). San Diego, USA, 30/May/2006-02/Jun/2006. (2006) pp. 251-257.
  34. M. Rencz, "Thermal qualification of 3D stacked die structures", In: Proceedings of the 10th Biennial Baltic Electronics Conference. Tallinn, Estonia, 02/Oct/2006-04/Oct/2006. pp. 23-30.
  35. A. Poppe, G. Farkas, Gy. Horváth, "Electrical, thermal and optical characterization of power LED assemblies", In: Proceedings of the 12th International Workshop on Thermal investigations of ICs and Systems (THERMINIC'06). Nice, France, 27/Sep/2006-29/Sep/2006. pp. 197-202.
  36. A. Poppe, "Thermal Measurements and Qualification IC Packages Using the Transient Method: Principles and Applications", Half day tutorial at 1st Electronics Systemintegration Technology Conference, September 2006. (ESTC'06) Dresden, Germany (2006)
  37. A. Poppe, Y. Zhang, J. Wilson, G. Farkas, P. Szabó, J. Parry, "Thermal measurement and modeling of multi-die packages", In: Proceedings of the 12th International Workshop on Thermal investigations of ICs and Systems (THERMINIC'06). Nice, France, 27/Sep/2006-29/Sep/2006. pp. 191-196.
  38. A. Poppe, Y. Zhang, G. Farkas, H. Won, J. Wilson, P. Szabó, "Thermal characterization of multi-die packages", In: Proceedings of the 8th Electronics Packaging Technology Conference (EPTC'06): Volume Two. Singapore, 06/Dec/2006-08/Dec/2006. pp. 500-505.
  39. P. Szabó, M. Rencz, V. Székely, A. Poppe, G. Farkas, B. Courtois, "Thermal Characterization and Modeling of Stacked Die Packages", In: Proceedings of the InterPACK'05. San Francisco, USA, 17/Jul/2005-22/Jul/2005. pp. 1575-1581.
  40. M. Rencz, "Thermal Issues in Stacked die Packages", In: Proceedings of the 21st IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'05). San Jose, USA, 15/Mar/2005-17/Mar/2005. pp. 307-312.
  41. A. Poppe, G. Farkas, V. Székely, Gy. Horváth, M. Rencz, "Multi-domain simulation and measurement of power LED-s and power LED assemblies", In: Proceedings of the 22nd IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM'06). Dallas, USA, 14/Mar/2006-16/Mar/2006.
  42. M. Rencz, A. Poppe, E. Kollár, S. Ress, V. Székely, "Increasing the accuracy of structure function based thermal material parameter measurements", IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 28:(1) pp. 51-57. (2005)
  43. P. Szabó, G. Perlaky, Gy. Bognár, Gy. Horváth, S. Ress, A. Poppe, V. Székely, M. Rencz, B. Courtois, "Thermo-mechanical characterization and integrity checking of packages and movable-structures", In: Technical Proceedings of the 2005 NSTI Nanotechnology Conference and Trade Show (NANOTECH'05): Volume 3. Anaheim, USA, 08/May/2005-12/May/2005. pp. 331-334.
  44. P. Szabó, M. Rencz, V. Székely, A. Poppe, G. Farkas, B. Courtois, "Thermal Modelling of Multiple Die Packages", In: Proceedings of the 7th Electronics Packaging Technology Conference (EPTC'05): Volume Two. Singapore, 07/Dec/2005-09/Dec/2005. pp. 521-525.
  45. Gy. Horváth, Gy. Bognár, P. Szabó, S. Ress, A. Poppe, V. Székely, M Rencz, "Novel non-contact measurement methods on semiconductor structures", In: Proceedings of the International Conference Microtechnology and Thermal Problems in Electronics (MICROTHERM'05). Lodz, Poland, 19/Jun/2005-22/Jun/2005. pp. 50-57.
  46. Gy. Horváth, A. Poppe, "Application of modern software technologies in electro-thermal simulation", In: Proceedings of the 8th IEEE Workshop on Design and Diagnostics of Electronic Circuits and Systems (DDECS'05). Sopron, Hungary, 13/Apr/2005-16/Apr/2005. pp. 248-250.
  47. Gy. Horváth, A. Poppe, "The Sissy Electro-Thermal Simulation System - Based on Modern Software Technologies", In: Proceedings of the 11th International Workshop on Thermal investigations of ICs and Systems (THERMINIC'05). Belgirate, Italy, 27/Sep/2005-30/Sep/2005. pp. 51-54.
  48. G. Farkas, Q. van Voorst Vader, A. Poppe, Gy. Bognár, "Thermal Investigation of High Power Optical Devices by Transient Testing", IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 28:(1) pp. 45-50. (2005)
  49. V. Székely, A. Poppe, G. Hajas, "Electro-thermal Transistor Models in the Sissi Electro-thermal IC Simulator", In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE'04). Bruxelles, Belgium, 10/May/2004-12/May/2004. pp. 105-112.
  50. Brockherde, Werner, et al: "High Dynamic Range CMOS Camera for Automotive Applications" Conference on Advanced Microsystems for Automotive Applications AMAA 2005, March 17-18, Berlin.
  51. Brockherde, Werner, et al: "High-Sensitivity, High-Dynamic Range 768x576 Pixel CMOS Image Sensor", Proceedings of the 2004 European Solid-State Circuits Conference, Leuven, September 2004.
  52. Schrey, Olaf, et al: "A 4x64 Pixel CMOS Image Sensor for 3D Measurement Applications", European Solid-State Circuits Conference 2003, Estoril, September 16.-18.,2003.
  53. R. Jeremias, W. Brockherde, G. Doemens, B. Hosticka, L. Listl, P. Mengel "A CMOS Photosensor Array for 3D Imaging Using Pulsed Laser", Tech. Digest, IEEE Int. Solid- State Circ. Conf. (ISSCC 2001), San Francisco CA, USA, pp. 252ff, Feb.2001
  54. Durini, Daniel et al: "Time-of-Flight 3-D imaging pixel structures in standard CMOS processes", IEEE Journal of Solid-State Circuits 43 (2008) 7, pp. 1594-1602.
  55. Roger Steadman, Francisco Morales Serrano, Gereon Vogtmeier, Armin Kemna, Erol Oezkan, Werner Brockherde, and Bedrich J. Hosticka: "A CMOS Photodiode Array With In-Pixel Data Acquisition System for Computed Tomography", IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 39, NO. 7, JULY 2004



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